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Temperature measurement in the electronics industry

Circuit boards are the core of the electronics industry. While continuously getting smaller, their power has to increase to meet quality expectancy. To increase the product quality while decreasing manufacturing time and lower production costs at the same time, state of the art control and measuring processes are applied from development to manufacturing as well as quality monitoring. Non-contact temperature measurement using stationary thermal imagers and pyrometers is a key part of the process.

In order to precisely measure the temperature of small components, an MFOV (Measurement Field of View) of 3x3 pixels must be considered. The optris PI 640 infrared camera with microscope optics for example features an MFOV of 85 µm and can thus reliably measure tiny resistors of 1.55 x 0.85 mm. 

Component inspection

Component inspection

Infrared cameras with microscope optics as well as high performance infrared thermometers allow for the detection of smallest measurement areas or spots (28 µm). By this, single components and junctions can be checked for heating spots or heat impact among each other.

Recommended device:
Microscope optics

Recommeded literature:
Infrared cameras in electronics development

Video: Optris IR Microscope optics

 

Design validation

Design validation

Electronic assemblies have to get smaller, more powerful as well as more cost effective. Design - both the arrangement and the application of the elements - is a key factor. Infrared measurement technology ensures an efficent heat management. The VGA thermal imager optris® PI 640 is perfectly suited fot these tasks.

Recommended device:
optris PI 640